- Manufacturer：
-
- AIRODYN (20)
- AMEC Thermasol (5)
- Bergquist (20)
- CUI Devices (52)
- Leader Tech Inc. (10)
- Parker Chomerics (8)
- t-Global Technology (50)
- Product Status：
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- Type：
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- Thickness：
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- Material：
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- Shape：
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- Thermal Conductivity：
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- Outline：
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- Backing, Carrier：
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- Thermal Resistivity：
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- Filter：
399 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Laird Technologies - Thermal Materials | 1 |
46
In-stock
|
Get Quote | |||
|
|
Bergquist | 1 |
286
In-stock
|
Get Quote | |||
|
|
Parker Chomerics | 1 |
260
In-stock
|
Get Quote | |||
|
|
Laird Technologies - Thermal Materials | 1 |
120
In-stock
|
Get Quote | |||
|
|
Laird Technologies - Thermal Materials | 1 |
31
In-stock
|
Get Quote | |||
|
|
Parker Chomerics | 1 |
29
In-stock
|
Get Quote | |||
|
|
t-Global Technology | 1 |
466
In-stock
|
Get Quote | |||
|
|
t-Global Technology | 1 |
30
In-stock
|
Get Quote | |||
|
|
Laird Technologies - Thermal Materials | 1 |
135
In-stock
|
Get Quote | |||
|
|
Parker Chomerics | 1 |
5
In-stock
|
Get Quote | |||
|
|
Taica North America Corporation | 1 |
33
In-stock
|
Get Quote | |||
|
|
Bergquist | 1 |
72
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 | Get Quote | ||||
|
|
CUI Devices | 1 |
74
In-stock
|
Get Quote | |||
|
|
Leader Tech Inc. | 1 |
52
In-stock
|
Get Quote | |||
|
|
t-Global Technology | 1 |
82
In-stock
|
Get Quote | |||
|
|
Laird Technologies - Thermal Materials | 1 |
83
In-stock
|
Get Quote | |||
|
|
Taica North America Corporation | 1 |
75
In-stock
|
Get Quote | |||
|
|
t-Global Technology | 1 |
7
In-stock
|
Get Quote | |||
|
|
Leader Tech Inc. | 1 |
82
In-stock
|
Get Quote |