- Manufacturer:
-
- Bergquist (6)
- Parker Chomerics (10)
- Thickness:
-
- Material:
-
- Shape:
-
- Adhesive:
-
- Thermal Conductivity:
-
- Outline:
-
- Backing, Carrier:
-
26 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
![]() |
Laird Technologies - Thermal Materials | 1 |
344
In-stock
|
Get Quote | |||
![]() |
Laird Technologies - Thermal Materials | 1 |
306
In-stock
|
Get Quote | |||
![]() |
Laird Technologies - Thermal Materials | 1 |
162
In-stock
|
Get Quote | |||
![]() |
Laird Technologies - Thermal Materials | 1 |
215
In-stock
|
Get Quote | |||
![]() |
Parker Chomerics | 1 |
10
In-stock
|
Get Quote | |||
![]() |
Parker Chomerics | 1 |
149
In-stock
|
Get Quote | |||
![]() |
Parker Chomerics | 1 |
118
In-stock
|
Get Quote | |||
![]() |
Bergquist | 1 |
49
In-stock
|
Get Quote | |||
![]() |
Parker Chomerics | 1 |
260
In-stock
|
Get Quote | |||
![]() |
Essentra Components | 1 |
1,938
In-stock
|
Get Quote | |||
![]() |
Parker Chomerics | 1 |
24
In-stock
|
Get Quote | |||
![]() |
Bergquist | 1 |
3
In-stock
|
Get Quote | |||
![]() |
Parker Chomerics | 1 |
36
In-stock
|
Get Quote | |||
![]() |
Laird Technologies - Thermal Materials | 1 |
49
In-stock
|
Get Quote | |||
![]() |
Bergquist | 1 | Get Quote | ||||
![]() |
Bergquist | 1 | Get Quote | ||||
![]() |
Bergquist | 1 | Get Quote | ||||
![]() |
Parker Chomerics | 1 |
24
In-stock
|
Get Quote | |||
![]() |
Bergquist | 1 | Get Quote | ||||
![]() |
Parker Chomerics | 1 | Get Quote |