Product Status:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
173 Records
Image Part Manufacturer Description MOQ Stock Action
HSE-B2111-038 CUI Devices
HEAT SINK, EXTRUSION, TO-220, 25
1
18,595
In-stock
Get Quote
HSS-B20-NP-12 CUI Devices
HEATSINK TO-220 6.8W ALUMINUM
1
3,151
In-stock
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HSB02-101007 CUI Devices
HEAT SINK, BGA, 10 X 10 X 7 MM
1
5,833
In-stock
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HSB03-141406 CUI Devices
HEAT SINK, BGA, 14 X 14 X 6 MM
1
2,186
In-stock
Get Quote
HSB10-232306 CUI Devices
HEAT SINK, BGA, 23 X 23 X 6 MM
1
1,346
In-stock
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HSB08-212106 CUI Devices
HEAT SINK, BGA, 21 X 21 X 6 MM
1
1,795
In-stock
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HSB12-272706 CUI Devices
HEAT SINK, BGA, 27 X 27 X 6 MM
1
1,567
In-stock
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HSS10-B20-P40 CUI Devices
HEAT SINK, STAMPING, TO-220, 29.
1
2,788
In-stock
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HSB03-121218 CUI Devices
HEAT SINK, BGA, 12 X 12 X 18 MM
1
1,066
In-stock
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HSB09-212115 CUI Devices
HEAT SINK, BGA, 21 X 21 X 15 MM
1
2,240
In-stock
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HSB18-232310 CUI Devices
HEAT SINK, BGA, 23 X 23 X 10 MM
1
5,414
In-stock
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HSE-B250-04H CUI Devices
HEAT SINK, EXTRUSION, TO-220, 25
1
2,506
In-stock
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HSS03-B20-P318 CUI Devices
HEAT SINK, STAMPING, TO-220, 41.
1
1,922
In-stock
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HSS02-B20-P318 CUI Devices
HEAT SINK, STAMPING, TO-220, 23.
1
1,594
In-stock
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HSB23-232325 CUI Devices
HEAT SINK, BGA, 23 X 23 X 25 MM
1
1,148
In-stock
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HSS01-B20-CP CUI Devices
HEAT SINK, STAMPING, TO-220, 49.
1
1,182
In-stock
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HSB14-353518 CUI Devices
HEAT SINK, BGA, 35 X 35 X 18 MM
1
1,031
In-stock
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HSB16-404018 CUI Devices
HEAT SINK, BGA, 40 X 40 X 18 MM
1
885
In-stock
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HSB17-404025 CUI Devices
HEAT SINK, BGA, 40 X 40 X 25 MM
1
1,134
In-stock
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HSS-B20-065V-02 CUI Devices
HEATSINK TO-220 2.9W ALUMINUM
1
1,759
In-stock
Get Quote
1 / 9 Page, 173 Records