- Manufacturer：
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- CUI Devices (2)
- Sarnikon (1)
- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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5 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | 1 |
18,445
In-stock
|
Get Quote | |||
|
|
Assmann WSW Components | 1 |
21,602
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
1,186
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
978
In-stock
|
Get Quote | |||
|
|
Sarnikon | 200 |
500
In-stock
|
Get Quote |