Attachment Method:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSE05-171933 CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
1
3,230
In-stock
Get Quote
V5616Y-T Assmann WSW Components
HEATSINK ALUM ANOD
1,500 Get Quote
V5616X-T Assmann WSW Components
HEATSINK ALUM ANOD
2,550 Get Quote
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