- Manufacturer：
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- CUI Devices (2)
- Sarnikon (9)
- Material：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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13 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | 1 |
21,602
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
1,186
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
1,113
In-stock
|
Get Quote | |||
|
|
Assmann WSW Components | 1 |
16
In-stock
|
Get Quote | |||
|
|
Sarnikon | 100 |
500
In-stock
|
Get Quote | |||
|
|
Sarnikon | 100 |
500
In-stock
|
Get Quote | |||
|
|
Sarnikon | 50 |
500
In-stock
|
Get Quote | |||
|
|
Sarnikon | 50 |
500
In-stock
|
Get Quote | |||
|
|
Sarnikon | 10 |
10
In-stock
|
Get Quote | |||
|
|
Sarnikon | 50 |
50
In-stock
|
Get Quote | |||
|
|
Sarnikon | 10 |
10
In-stock
|
Get Quote | |||
|
|
Sarnikon | 10 |
10
In-stock
|
Get Quote | |||
|
|
Sarnikon | 10 |
10
In-stock
|
Get Quote |