- Manufacturer:
-
- CUI Devices (2)
- Sarnikon (9)
- Material:
-
- Width:
-
- Attachment Method:
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- Package Cooled:
-
- Fin Height:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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13 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
![]() |
Assmann WSW Components | 1 |
21,602
In-stock
|
Get Quote | |||
![]() |
CUI Devices | 1 |
1,186
In-stock
|
Get Quote | |||
![]() |
CUI Devices | 1 |
1,113
In-stock
|
Get Quote | |||
![]() |
Assmann WSW Components | 1 |
16
In-stock
|
Get Quote | |||
![]() |
Sarnikon | 100 |
500
In-stock
|
Get Quote | |||
![]() |
Sarnikon | 100 |
500
In-stock
|
Get Quote | |||
![]() |
Sarnikon | 50 |
500
In-stock
|
Get Quote | |||
![]() |
Sarnikon | 50 |
500
In-stock
|
Get Quote | |||
![]() |
Sarnikon | 10 |
10
In-stock
|
Get Quote | |||
![]() |
Sarnikon | 50 |
50
In-stock
|
Get Quote | |||
![]() |
Sarnikon | 10 |
10
In-stock
|
Get Quote | |||
![]() |
Sarnikon | 10 |
10
In-stock
|
Get Quote | |||
![]() |
Sarnikon | 10 |
10
In-stock
|
Get Quote |