- Manufacturer:
-
- CUI Devices (2)
- Wakefield-Vette (2)
- Material:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
9 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
![]() |
Wakefield-Vette | 1 |
10,789
In-stock
|
Get Quote | |||
![]() |
Wakefield-Vette | 1 |
8,146
In-stock
|
Get Quote | |||
![]() |
Aavid, Thermal Division of Boyd Corporation | 1 |
4,316
In-stock
|
Get Quote | |||
![]() |
Advanced Thermal Solutions Inc. | 1 |
2,694
In-stock
|
Get Quote | |||
![]() |
Aavid, Thermal Division of Boyd Corporation | 1 |
1,148
In-stock
|
Get Quote | |||
![]() |
Assmann WSW Components | 1 |
515
In-stock
|
Get Quote | |||
![]() |
CUI Devices | 1 |
132
In-stock
|
Get Quote | |||
![]() |
CUI Devices | 1 |
185
In-stock
|
Get Quote | |||
![]() |
NTE Electronics, Inc | 1 |
110
In-stock
|
Get Quote |