- Manufacturer：
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- CUI Devices (2)
- Wakefield-Vette (2)
- Material：
-
- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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9 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield-Vette | 1 |
10,789
In-stock
|
Get Quote | |||
|
|
Wakefield-Vette | 1 |
8,146
In-stock
|
Get Quote | |||
|
|
Aavid, Thermal Division of Boyd Corporation | 1 |
4,316
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions Inc. | 1 |
2,694
In-stock
|
Get Quote | |||
|
|
Aavid, Thermal Division of Boyd Corporation | 1 |
1,148
In-stock
|
Get Quote | |||
|
|
Assmann WSW Components | 1 |
515
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
132
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
185
In-stock
|
Get Quote | |||
|
|
NTE Electronics, Inc | 1 |
110
In-stock
|
Get Quote |