Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSE06-503045 CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
1
1,186
In-stock
Get Quote
HSE07-753045 CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
1
978
In-stock
Get Quote
1 / 1 Page, 2 Records