- Manufacturer:
-
- CUI Devices (1)
- Wakefield-Vette (2)
- Material:
-
- Attachment Method:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
4 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
![]() |
CUI Devices | 1 |
990
In-stock
|
Get Quote | |||
![]() |
Wakefield-Vette | 128 | Get Quote | ||||
![]() |
Wakefield-Vette | 128 | Get Quote | ||||
![]() |
CTS Electrocomponents | 1 | Get Quote |