- Manufacturer：
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- CUI Devices (1)
- Wakefield-Vette (2)
- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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4 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | 1 |
990
In-stock
|
Get Quote | |||
|
|
Wakefield-Vette | 128 | Get Quote | ||||
|
|
Wakefield-Vette | 128 | Get Quote | ||||
|
|
CTS Electrocomponents | 1 | Get Quote |