- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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6 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | 1 |
32,702
In-stock
|
Get Quote | |||
|
|
Aavid, Thermal Division of Boyd Corporation | 1 |
7,864
In-stock
|
Get Quote | |||
|
|
Aavid, Thermal Division of Boyd Corporation | 1 |
1,872
In-stock
|
Get Quote | |||
|
|
Aavid, Thermal Division of Boyd Corporation | 1 |
1,689
In-stock
|
Get Quote | |||
|
|
Aavid, Thermal Division of Boyd Corporation | 2,000 | Get Quote | ||||
|
|
Aavid, Thermal Division of Boyd Corporation | 2,000 | Get Quote |