- Manufacturer:
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- CUI Devices (1)
- Wakefield-Vette (1)
- Material:
-
- Attachment Method:
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- Fin Height:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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2 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
![]() |
Wakefield-Vette | 1 |
31,175
In-stock
|
Get Quote | |||
![]() |
CUI Devices | 1 |
611
In-stock
|
Get Quote |