Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Image Part Manufacturer Description MOQ Stock Action
HSB14-353518 CUI Devices
HEAT SINK, BGA, 35 X 35 X 18 MM
1
1,031
In-stock
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4-1542006-1 TE Application Tooling
42.5MM HS ASSY ULTEM
1 Get Quote
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