Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
ATS-PCB1019 Advanced Thermal Solutions Inc.
HEATSINK TO-218/TO-202/TO-220
1
1,338
In-stock
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HSS21-B20-P53 CUI Devices
HEAT SINK, STAMPING, TO-218/TO-2
3,000
Get Quote
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