- Attachment Method:
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- Package Cooled:
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- Fin Height:
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- Thermal Resistance @ Forced Air Flow:
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2 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
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CUI Devices | 1,800 | Get Quote | ||||
![]() |
CUI Devices | 1,350 | Get Quote |