Image Part Manufacturer Description MOQ Stock Action
HSB10-232306 CUI Devices
HEAT SINK, BGA, 23 X 23 X 6 MM
1
1,346
In-stock
Get Quote
HSB08-212106 CUI Devices
HEAT SINK, BGA, 21 X 21 X 6 MM
1
1,795
In-stock
Get Quote
1 / 1 Page, 2 Records