Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSE08-505028 CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
1
1,113
In-stock
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HSE09-755028 CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
1 Get Quote
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