- Manufacturer：
-
- CUI Devices (2)
- Sarnikon (5)
- Wakefield-Vette (3)
- Material：
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- Length：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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10 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield-Vette | 1 |
324
In-stock
|
Get Quote | |||
|
|
Wakefield-Vette | 1 |
1,164
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
1,113
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 | Get Quote | ||||
|
|
Wakefield-Vette | 1,000 | Get Quote | ||||
|
|
Sarnikon | 1 | Get Quote | ||||
|
|
Sarnikon | 10 |
10
In-stock
|
Get Quote | |||
|
|
Sarnikon | 1 | Get Quote | ||||
|
|
Sarnikon | 10 |
10
In-stock
|
Get Quote | |||
|
|
Sarnikon | 10 |
10
In-stock
|
Get Quote |