- Manufacturer:
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- CUI Devices (5)
- Material:
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- Attachment Method:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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8 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
![]() |
CUI Devices | 1 |
3,950
In-stock
|
Get Quote | |||
![]() |
CUI Devices | 1 |
2,879
In-stock
|
Get Quote | |||
![]() |
Advanced Thermal Solutions Inc. | 1 |
23
In-stock
|
Get Quote | |||
![]() |
Advanced Thermal Solutions Inc. | 1 |
12
In-stock
|
Get Quote | |||
![]() |
CUI Devices | 1 |
702
In-stock
|
Get Quote | |||
![]() |
CUI Devices | 1 |
750
In-stock
|
Get Quote | |||
![]() |
CUI Devices | 1 |
92
In-stock
|
Get Quote | |||
![]() |
TE Application Tooling | 1 | Get Quote |