- Manufacturer：
-
- CUI Devices (3)
- Type：
-
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
7 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | 1 |
1,871
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
2,980
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
1,973
In-stock
|
Get Quote | |||
|
|
t-Global Technology | 1 |
196
In-stock
|
Get Quote | |||
|
|
Assmann WSW Components | 1 |
585
In-stock
|
Get Quote | |||
|
|
t-Global Technology | 1 |
123
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1,000 | Get Quote |