Image Part Manufacturer Description MOQ Stock Action
HSE-B2111-038 CUI Devices
HEAT SINK, EXTRUSION, TO-220, 25
1
18,595
In-stock
Get Quote
BGAH190-090E Ohmite
BGA HEATSINK W/TAPE
1
218
In-stock
Get Quote
HSB07-202009 CUI Devices
HEAT SINK, BGA, 20 X 20 X 9 MM
1
1,852
In-stock
Get Quote
V2269E1 Assmann WSW Components
CPU HEATSINK, CROSS CUT, AL6063,
1
195
In-stock
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HSE-B1711-057 CUI Devices
HEAT SINK, EXTRUSION, TO-220, 25
2,500 Get Quote
HSE-B1711-032 CUI Devices
HEAT SINK, EXTRUSION, TO-220, 25
2,500 Get Quote
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