- Manufacturer:
-
- CUI Devices (4)
- Ohmite (1)
- Type:
-
- Attachment Method:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
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6 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
![]() |
CUI Devices | 1 |
18,595
In-stock
|
Get Quote | |||
![]() |
Ohmite | 1 |
218
In-stock
|
Get Quote | |||
![]() |
CUI Devices | 1 |
1,852
In-stock
|
Get Quote | |||
![]() |
Assmann WSW Components | 1 |
195
In-stock
|
Get Quote | |||
![]() |
CUI Devices | 2,500 | Get Quote | ||||
![]() |
CUI Devices | 2,500 | Get Quote |