- Manufacturer：
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- CUI Devices (4)
- Ohmite (1)
- Type：
-
- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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6 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | 1 |
18,595
In-stock
|
Get Quote | |||
|
|
Ohmite | 1 |
218
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
1,852
In-stock
|
Get Quote | |||
|
|
Assmann WSW Components | 1 |
195
In-stock
|
Get Quote | |||
|
|
CUI Devices | 2,500 | Get Quote | ||||
|
|
CUI Devices | 2,500 | Get Quote |