- Manufacturer：
-
- CUI Devices (4)
- Ohmite (1)
- Material：
-
- Shape：
-
- Length：
-
- Width：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
24 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | 2,500 | Get Quote | ||||
|
|
Aavid, Thermal Division of Boyd Corporation | 4,000 | Get Quote | ||||
|
|
t-Global Technology | 3,000 | Get Quote | ||||
|
|
Trenz Electronic GmbH | 1 | Get Quote |