- Manufacturer：
-
- CUI Devices (3)
- iBASE Technology (1)
- Sarnikon (4)
- Wakefield-Vette (8)
- Type：
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- Material：
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- Length：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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38 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions Inc. | 1 |
214
In-stock
|
Get Quote | |||
|
|
Assmann WSW Components | 1 |
2,454
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions Inc. | 1 |
107
In-stock
|
Get Quote | |||
|
|
Assmann WSW Components | 1 |
1,249
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
1,361
In-stock
|
Get Quote | |||
|
|
Assmann WSW Components | 1 |
791
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions Inc. | 1 |
85
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions Inc. | 1 |
17
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions Inc. | 1 |
5
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions Inc. | 1 |
4
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions Inc. | 1 |
2
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
500
In-stock
|
Get Quote | |||
|
|
Wakefield-Vette | 1 |
89
In-stock
|
Get Quote | |||
|
|
Aavid, Thermal Division of Boyd Corporation | 1 |
100
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions Inc. | 1 |
1
In-stock
|
Get Quote | |||
|
|
iBASE Technology | 1 | Get Quote | ||||
|
|
Assmann WSW Components | 500 | Get Quote | ||||
|
|
Assmann WSW Components | 500 | Get Quote | ||||
|
|
Assmann WSW Components | 480 | Get Quote | ||||
|
|
CUI Devices | 1,380 | Get Quote |