- Manufacturer：
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- CUI Devices (2)
- Length：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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8 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | 1 |
1,756
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
2,975
In-stock
|
Get Quote | |||
|
|
Assmann WSW Components | 1 |
861
In-stock
|
Get Quote | |||
|
|
Assmann WSW Components | 1 |
526
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions Inc. | 1 |
21
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions Inc. | 1 | Get Quote | ||||
|
|
CUI Devices | 3,000 | Get Quote | ||||
|
|
Assmann WSW Components | 1,000 | Get Quote |