- Manufacturer:
-
- CUI Devices (2)
- Wakefield-Vette (1)
- Material:
-
- Width:
-
- Attachment Method:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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8 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
![]() |
Assmann WSW Components | 1 |
1,756
In-stock
|
Get Quote | |||
![]() |
Seeed Technology Co., Ltd | 1 |
145
In-stock
|
Get Quote | |||
![]() |
Wakefield-Vette | 1 |
1,005
In-stock
|
Get Quote | |||
![]() |
CUI Devices | 1 |
2,975
In-stock
|
Get Quote | |||
![]() |
Assmann WSW Components | 1 |
861
In-stock
|
Get Quote | |||
![]() |
Assmann WSW Components | 1 |
526
In-stock
|
Get Quote | |||
![]() |
CUI Devices | 3,000 | Get Quote | ||||
![]() |
Assmann WSW Components | 1,000 | Get Quote |