- Manufacturer：
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- CUI Devices (2)
- Wakefield-Vette (1)
- Material：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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8 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | 1 |
1,756
In-stock
|
Get Quote | |||
|
|
Seeed Technology Co., Ltd | 1 |
145
In-stock
|
Get Quote | |||
|
|
Wakefield-Vette | 1 |
1,005
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
2,975
In-stock
|
Get Quote | |||
|
|
Assmann WSW Components | 1 |
861
In-stock
|
Get Quote | |||
|
|
Assmann WSW Components | 1 |
526
In-stock
|
Get Quote | |||
|
|
CUI Devices | 3,000 | Get Quote | ||||
|
|
Assmann WSW Components | 1,000 | Get Quote |