Manufacturer:
Product Status:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSS27-B20-P43 CUI Devices
HEAT SINK, STAMPING, TO-218/TO-2
1
2,400
In-stock
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811102B00000 Comair Rotron
HEATSINK STAMP 22.2X5.4X30.3MM
1
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