Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
374324B60023G Aavid, Thermal Division of Boyd Corporation
BGA HEAT SINK
1
3,722
In-stock
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374724B60024G Aavid, Thermal Division of Boyd Corporation
HEATSINK BGA W/O SOLDER ANCHORS
1
1,118
In-stock
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