Size / Dimension:
Usable Temperature Range:
Image Part Manufacturer Description MOQ Stock Action
TC-GC-03-D Gelid Solutions LLC
THERMAL COMPOUND 1GR, 8.5W
1
159
In-stock
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TC-GC-03-A Gelid Solutions LLC
THERMAL COMPOUND 3.5GR, 8.5W
1
260
In-stock
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120-8 Wakefield-Vette
SILICONE GREASE 8 OZ JAR
1
59
In-stock
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8349TFM-25ML MG Chemicals
THERMAL ADHESIVE 25ML
1
73
In-stock
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GF1000-00-15-50CC Bergquist
GF1000 50CC DUAL CARTRIDGE
1
49
In-stock
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8329TFS-50ML MG Chemicals
SLOW CURE THERM COND ADH FLOW
1
47
In-stock
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1978-1 Techspray
SILICONE FREE HEAT SINK
1
29
In-stock
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GF3500S35-07-60-50CC Bergquist
LIQUID GAP FILLER THERMAL CONDU
1
61
In-stock
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832TC-450ML MG Chemicals
THERMALLY CONDUCTIVE EPOXY
1
36
In-stock
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GF4000-00-240-50CC Bergquist
GAP FILLER 4000 50CC CARTRIDGE
1
4
In-stock
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S606C-1000 t-Global Technology
SILICONE THERMAL GREASE 1KG
1 Get Quote
HSC67-6G CAIG Laboratories, Inc.
SILICONE HEAT SINK COMPOUND SQUE
1
36
In-stock
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TC3-1G Chip Quik Inc.
HEAT SINK THERMAL COMPOUND
1
89
In-stock
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TC1-10G Chip Quik Inc.
HEAT SINK COMPOUND - HIGH DENSIT
1
41
In-stock
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TC4-1G Chip Quik Inc.
HEAT SINK THERMAL COMPOUND - DEE
1
35
In-stock
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BT-103-50M Wakefield-Vette
5 MINUTE CLEAR BONDATHERM EPOXY
1
25
In-stock
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BT-101-50M Wakefield-Vette
NON-SAG 5 MINUTE BONDATHERM EPOX
1
66
In-stock
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BT-102-50M Wakefield-Vette
TOUGHENED, FLEXIBLE ADHESIVE SYS
1
38
In-stock
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TC3-3.5G Chip Quik Inc.
HEAT SINK THERMAL COMPOUND
1
46
In-stock
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9460TC-3ML MG Chemicals
THERMALLY CONDUCTIVE 1-PART EPOX
1
32
In-stock
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