Thermal - Analog Device, NXP, Texas parts distributor

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469 Records

Part	Manufacturer	Description	MOQ		Stock	Action
HSE05-171933	CUI Devices	HEAT SINK, EXTRUSION, TO-218/TO-	1	PDF	3,230 In-stock	Get Quote
HSE02-173213	CUI Devices	HEAT SINK, EXTRUSION, 17 X 31.9	1	PDF	1,538 In-stock	Get Quote
HSB15-404010	CUI Devices	HEAT SINK, BGA, 40 X 40 X 10 MM	1	PDF	1,274 In-stock	Get Quote
HSE-B18254-0396H	CUI Devices	HEAT SINK, EXTRUSION,TO-218, 25.	1	PDF	1,800 In-stock	Get Quote
HSE-B18508-035H	CUI Devices	HEAT SINK, EXTRUSION, TO-218, 50	1	PDF	1,350 In-stock	Get Quote
HSE01-193175P	CUI Devices	HEAT SINK, EXTRUSION, 19 X 31.5	1	PDF	678 In-stock	Get Quote
HSB20-353525	CUI Devices	HEAT SINK, BGA, 35 X 35 X 25 MM	1	PDF	1,253 In-stock	Get Quote
HSB30-373710	CUI Devices	HEAT SINK, BGA, 37.4 X 37 X 10 M	1	PDF	665 In-stock	Get Quote
HSE06-503045	CUI Devices	HEAT SINK, EXTRUSION, TO-218/TO-	1	PDF	1,186 In-stock	Get Quote
HSE08-505028	CUI Devices	HEAT SINK, EXTRUSION, TO-218/TO-	1	PDF	1,113 In-stock	Get Quote
HSB27-434316	CUI Devices	HEAT SINK, BGA, 43.1 X 43.1 X 16	1	PDF	1,057 In-stock	Get Quote
HSE02-173213P	CUI Devices	HEAT SINK, EXTRUSION, 17 X 31.9	1	PDF	1,336 In-stock	Get Quote
HSE07-753045	CUI Devices	HEAT SINK, EXTRUSION, TO-218/TO-	1	PDF	978 In-stock	Get Quote
HSB28-606022	CUI Devices	HEAT SINK, BGA, 60 X 60 X 22 MM,	1	PDF	220 In-stock	Get Quote
HSS-B20-0635H-01	CUI Devices	HEATSINK TO-220 2.7W ALUMINUM	1	PDF	727 In-stock	Get Quote
HSS-B20-CP-01	CUI Devices	HEATSINK TO-220 2.6W ALUMINUM	1	PDF	540 In-stock	Get Quote
HSE-B20250-040H-01	CUI Devices	HEAT SINK, EXTRUSION, TO-220, 25	1	PDF	592 In-stock	Get Quote
HSE-B20254-035H	CUI Devices	HEAT SINK, EXTRUSION, TO-220,25.	1	PDF	877 In-stock	Get Quote
HSB06-181810	CUI Devices	HEAT SINK, BGA, 18 X 18 X 10 MM	1	PDF	663 In-stock	Get Quote
HSS13-B20-NP	CUI Devices	HEAT SINK, STAMPING, TO-220, 31	1	PDF	611 In-stock	Get Quote

4 / 24 Page, 469 Records

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