Thermal - Analog Device, NXP, Texas parts distributor

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469 Records

Part	Manufacturer	Description	MOQ		Stock	Action
HSE-B2111-038	CUI Devices	HEAT SINK, EXTRUSION, TO-220, 25	1	PDF	18,595 In-stock	Get Quote
HSS-B20-NP-12	CUI Devices	HEATSINK TO-220 6.8W ALUMINUM	1	PDF	3,151 In-stock	Get Quote
HSB02-101007	CUI Devices	HEAT SINK, BGA, 10 X 10 X 7 MM	1	PDF	5,833 In-stock	Get Quote
HSB03-141406	CUI Devices	HEAT SINK, BGA, 14 X 14 X 6 MM	1	PDF	2,186 In-stock	Get Quote
HSB10-232306	CUI Devices	HEAT SINK, BGA, 23 X 23 X 6 MM	1	PDF	1,346 In-stock	Get Quote
HSB08-212106	CUI Devices	HEAT SINK, BGA, 21 X 21 X 6 MM	1	PDF	1,795 In-stock	Get Quote
HSB12-272706	CUI Devices	HEAT SINK, BGA, 27 X 27 X 6 MM	1	PDF	1,567 In-stock	Get Quote
HSS10-B20-P40	CUI Devices	HEAT SINK, STAMPING, TO-220, 29.	1	PDF	2,788 In-stock	Get Quote
HSB03-121218	CUI Devices	HEAT SINK, BGA, 12 X 12 X 18 MM	1	PDF	1,066 In-stock	Get Quote
HSB09-212115	CUI Devices	HEAT SINK, BGA, 21 X 21 X 15 MM	1	PDF	2,240 In-stock	Get Quote
HSB18-232310	CUI Devices	HEAT SINK, BGA, 23 X 23 X 10 MM	1	PDF	5,414 In-stock	Get Quote
HSE-B250-04H	CUI Devices	HEAT SINK, EXTRUSION, TO-220, 25	1	PDF	2,506 In-stock	Get Quote
HSS03-B20-P318	CUI Devices	HEAT SINK, STAMPING, TO-220, 41.	1	PDF	1,922 In-stock	Get Quote
HSS02-B20-P318	CUI Devices	HEAT SINK, STAMPING, TO-220, 23.	1	PDF	1,594 In-stock	Get Quote
HSB23-232325	CUI Devices	HEAT SINK, BGA, 23 X 23 X 25 MM	1	PDF	1,148 In-stock	Get Quote
HSS01-B20-CP	CUI Devices	HEAT SINK, STAMPING, TO-220, 49.	1	PDF	1,182 In-stock	Get Quote
HSB14-353518	CUI Devices	HEAT SINK, BGA, 35 X 35 X 18 MM	1	PDF	1,031 In-stock	Get Quote
HSB16-404018	CUI Devices	HEAT SINK, BGA, 40 X 40 X 18 MM	1	PDF	885 In-stock	Get Quote
HSB17-404025	CUI Devices	HEAT SINK, BGA, 40 X 40 X 25 MM	1	PDF	1,134 In-stock	Get Quote
HSS-B20-065V-02	CUI Devices	HEATSINK TO-220 2.9W ALUMINUM	1	PDF	1,759 In-stock	Get Quote

1 / 24 Page, 469 Records

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