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Aavid, Thermal Division of Boyd Corporation |
INTEL XEON CPU COOLER 1U |
1 |
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Aavid, Thermal Division of Boyd Corporation |
78065 EXTRUSION 1.1X0.76"X4.1' |
1 |
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Aavid, Thermal Division of Boyd Corporation |
HEATSINK |
5,000 |
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Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK |
15,000 |
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Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK |
12,000 |
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Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK |
16,000 |
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Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK |
12,000 |
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Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK |
10,000 |
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Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK |
10,000 |
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Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK |
10,000 |
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Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK |
15,000 |
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Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK |
7,000 |
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Aavid, Thermal Division of Boyd Corporation |
HEATSINK |
3,000 |
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Aavid, Thermal Division of Boyd Corporation |
HEATSINK TO-220 2.5W H=1.5" BLK |
5,250 |
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Aavid, Thermal Division of Boyd Corporation |
HEATSINK 24-DIP BLK ANODIZED |
8,000 |
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Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK |
5,850 |
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Aavid, Thermal Division of Boyd Corporation |
HEATSINK 20-DIP BLK ANODIZED |
8,000 |
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Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK |
12,000 |
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Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK |
8,000 |
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Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK |
13,000 |
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Get Quote
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